The multi-chip module (MCM) plays an important role in microwave products. Its level of integration directly affect the miniaturization and lightweight of products.So far the vast majority of MCM in the military field still adopt the traditional two-dimensional multi-chip module (2D-MCM) form.For higher integration density,MCM should be transformed into the three-dimensional multi-chip module (3D-MCM) form.The microwave vertical interconnection process,which is the basis for 3D-MCM,is a key technology to realize the miniaturization and light weight of microwave products.But it has greater design complexity in the transmission and matching of microwave signals in the Ku band.On the basis of 3D-MCM simulation,a Ku band power division amplification is designed.Under the same performance index,the volume can be reduced by more than 40% compared with the products adopting traditional 2D-MCM.